Tool/software:
Disclaimer: Mechanical engineer trying to analyze electrical board.
Looking for guidance on thermal analysis for this chip. Is the R_thetaJC taking into account the leads or are the leads in addition?
For the analysis the chip is generating 3.5W in an environment of 71C in vacuum (all components are 71C when 3.5W starts). I do not have a good way to place a thermal gap pad, and I am limited to the 0.07mm copper ground plane in my board to route heat out of the chip, as there is no convection.
I originally modeled as 2 bodies with the lower half having the R_thetaJC and the upper body having the R_thetaJA (still air). I am exceeding the 125C operational temp of this chip.
Electrical Engineer suggested that a better model would be to separate into 3 bodies with a central conducting layer to the leads and insulating ceramic layers on top and bottom, but I am not sure what material to use to approximate the central layer.
What is a good recommendation?
