Tool/software:
We are using the 16 CFP (NAC) package for the LM117HVNAC/EM. I plan to open the solder mask under the body to provide a path for thermal relief.
Is this part designed to have the bottom side of the body soldered directly to a ground plane? In this case, both an electrical and thermal connection would be made.
Or it is better to put thermal paste (electrical insulator) under the body to provide thermal relief? This would provide a thermal connection only but insulate the case.
I plan to open the solder mask under the body to provide a path for thermal relief.