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CSD18540Q5B: thermal resistance

Daniel Cox
Prodigy 30 points
Part Number: CSD18540Q5B

Tool/software:

The datasheet for CSD18540Q5B lists 0.8 C/W for R_JC. Is this junction-to-case top, bottom, or both?

  • +1
    TI__Mastermind 36820 points

    Hello Daniel,

    Thanks for your interest in TI FETs. The RθJC specification in the datasheet is to the thermal (drain) pad on the bottom of the package. Please see the technical article at the link below for more information on how TI tests and specs thermal resistance in the MOSFET datasheet. Although TI does not spec it in the datasheet, RθJC(top) is about 8°C/W based on previous simulations and empirical data. Please let me know if you have any questions.

    https://www.ti.com/lit/pdf/SSZTB80

    Best Regards,

    John Wallace

    TI FET Applications