TPSM365R6: When soldering, solder paste flows into the backside pattern through the board via, how to deal with?

Shinichi Inoue

Guru 21056 points

Part Number: TPSM365R6

Tool/software:

Dear Specialists,

My customer is encountering soldering problem.

I would be grateful if you could advise.

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There are via in the land pattern example in the datasheet.

However when mounting, solder flows into the backside pattern through the board via.

How should this be dealt with?

Should I apply solder resist to the backside pattern?

Or I would like to eliminate the via if it is not necessary.

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I appreciate your great help in advance.

Best regards,

Shinichi

2 months ago

+1 Richard Fu22 2 months ago

TI__Mastermind 28110 points

Hi Shinichi,

I would not recommend removing the via since it is there to improve thermals. I would just add another equivalent polygon on the bottom side to also improve the thermals.

You can also try to bury the via or tent it.

Thanks,

Richard

+1 Shinichi Inoue 2 months ago in reply to Richard Fu22

Guru 21056 points

Hi Richard,

Thank you for your reply.

I found a application note how to deal bottom layer.

https://www.ti.com/lit/an/sloa120/sloa120.pdf

I'll share this information with the customer.

I appreciate your great help and cooperation.

Best regards,

Shinichi

0 Richard Fu22 1 month ago in reply to Shinichi Inoue

TI__Mastermind 28110 points

Hi Shinichi,

Got it, appreciate you promoting our device.

Cheers,

Richard

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TPSM365R6: When soldering, solder paste flows into the backside pattern through the board via, how to deal with?