TPSM53604: Bond Wires

Part Number: TPSM53604

Tool/software:

Hi Team,

Can you confirm if the TPSM53604RDAR has bond wires? If so, can you confirm what material is used (Cu vs Au)?

Regards,

0 Frank De Stasi 6 months ago

Hello

I will contact our product engineers and get back to you as soon as possible.

Thanks

0 Frank De Stasi 6 months ago in reply to Frank De Stasi

Hello

This package does not have bond wires.

Thanks

0 JP 6 months ago in reply to Frank De Stasi

Frank - Does the package use bumps to leadframe?

Regards,

0 Frank De Stasi 5 months ago in reply to JP

Hello

I will check with our PE about that question.

Thanks

0 Frank De Stasi 5 months ago in reply to Frank De Stasi

Hello

Yes, bumps to lead frame.

Thanks

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