LMG2650: Heat dissipation solution

Ryker She

Part Number: LMG2650
Other Parts Discussed in Thread: LMG2640

Tool/software:

Hi expert,

We are promoting LMG2640/ LMG2650 to customer and they are concerned about the heat dissipation. Could you share some heat dissipation solution and test result to us? Thanks.

Best Regards,

Ryker

9 months ago

0 Rohan Baliyan 9 months ago

TI__Prodigy 730 points

Hi Ryker,

Thanks for reaching out to us.

I am trying to connect with the respective team which can share the desired test data as soon as possible.

I will let you know by the end of the day.

Thanks for your patience.

Best Regards,

Rohan

0 John Gomez 9 months ago in reply to Rohan Baliyan

TI__Expert 7515 points

Hi Ryker,

What are the details of the application - such as topology, power level, end-equipment? The heat dissipation will be directly correlated to the expected power loss of the device under the application's conditions, as well as the thermal management (layout) for the device.

Thanks,

John

0 John Gomez 9 months ago in reply to John Gomez

TI__Expert 7515 points

Handling this request over email.

Power management

Power management forum

LMG2650: Heat dissipation solution