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TPS7H1111-SEP: TPS7H1111MPWPTSEP Thermal PAD soldering uncertainty

Benoit Résimont
Prodigy 20 points
Part Number: TPS7H1111-SEP

Tool/software:

Hi,

We have assembled two boards with the TPS7H1111MPWPTSEP reference.

After having performed XRAY analysis, we are not sure that the thermal pad is (correctly) soldered.

We have not yet power supplied our board.

In our application, the current consumption for this LDO will be less than 30mA (Vin = 5V and Vout = 3.75V).

If the PAD is not correctly soldered, is there a risk of abnormal operation or any other risk?

We don't think there is a thermal risk considering the low dissipated power but, electrically, will the component work nominally if it is not correctly soldered?

Regards,

Benoit

  • +1
    TI__Genius 11930 points

    Hi Benoit,

    For the plastic package TPS7H1111-SEP, not having an external electrical connection between thermal pad and GND could create unexpected issues (such as with noise performance). If there were a short that caused a higher current event, it could also potentially be a thermal concern as well.

    Thanks,

    Sarah