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TPS63020 Layout

Mike H Meyer
Expert 1560 points
Other Parts Discussed in Thread: TPS63020

The pictures for the layout regarding the power pad on the bottom of the TPS63020 vary between the datasheet and user guide.  Specifically on P.6 of the user guide I understand the grey to be copper and black to be solder paste.  The picture shows one large rectangle of solder paste with no cut-ins.  This varies from the example stencil design on P.23 of the datasheet.  Is there a reason to need to chop up the stencil into 12 pads?  Is a single pad any worse?

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    TI__Genius 17240 points

    The assembly drawing in the User's Guide shows the pad under the IC; a solid rectangle. The stencil is later made by the contract manufacture to meet their process requirements which ensure that the pad is soldered to the board and doesn't short other pins. This waffle method is preferred to prevent too much solder past from being applied. Having the correct amount of solder paste will also keep smaller parts from floating and becoming misaligned.