TPSM8A29: Reflow soldering temperature request

Hi Ryker, 

Is there a reason they heat the device to 45C for 48 hours before reflowing? Although I don't see a reason why this would affect the soldering/reflow process.

I think this may be more of a soldering/reflow issue. After reflowing, can you ask the customer to visually inspect and check the continuity between pins and make sure nothing is shorted before powering on? It may be due to the inner pads getting shorted. 

Best,

Ryan 

Hi Ryan,

Yes. Customer uses X-RAY to make sure nothing is shorted before powering on. The heat the devices before reflowing in case of the devices get wet.

• The found the VOUT (Pin10 and Pin11) issued devices are shorted to GND before they power on:
  • VOUT are shorted to GND after reflowing and test in board (didn't power on).
  • VOUT are still shorted to GND and test the signal device (Remove the devices from the board and didn't power on).
  • There are 2 issued devices that are not shorted once they powering on. And other issued devices that are still shorted after powering on. 
• Besides, could you confirm the reflow soldering temperature range of TPSM8A29?

Best Regards,

Ryker

Hi Ryker, 

I am looking into this and will get back to you in a couple of days. 

Best,

Ryan

Hi Ryker, 

Are you saying there only two devices will work after reflowing and power on? 

How many devices are being shorted after solder / reflow? 

Is the customer checking for shorts before power on and after reflowing? 

Are you saying the part has no short after reflowing and power on and then the part is shorted upon power on?

From this information it still seems like a solder / reflow issue. 

This device follows the TI standard for reflow soldering temperatures:

MSL Ratings and Reflow Profiles (Rev. A)

Best,

Ryan