Part Number: TPS62871-Q1
Tool/software:
When I power on this device, the device temperature up to 50°C (No load) , Why?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: TPS62871-Q1
Tool/software:
When I power on this device, the device temperature up to 50°C (No load) , Why?
Hi Willy,
Thanks for reaching out to us.
Before we discuss your issue, can you inform me what is the end equipment? Is it for automotive?
Best regards,
Excel
Hello Willy,
Ashika will takeover the thread as she is supporting consumer electronics.
Best regards,
Excel
Hi Willy,
Yes, I am looking into it. I will get back to you as soon as possible with an explanation.
I understand this is in regard to consumer electronics, but could you please let me know the end equipment?
Best Regards,
Ashika
Hi Willy,
Could you please let me know the test conditions, ie the input and output voltage
I reviewed the schematic, just a couple of inquiries.
- SYNC_OUT is left floating indicating a single device operation, but the PG pin is connected to the input power supply via a resistor? (if it is single device operation, then we must leave the PG pin floating or connect it to GND).
- Could you please let me know why we have a 1uF capacitor connected between VOSNS and GOSNS?
Also, I am reviewing the layout
-Could you please highlight the thermal pad layout?
Best Regards,
Ashika
Hi Ashika ,
Thanks!
- Test Condition:
Input voltage: 5.1V, Output: 0.85V (No Load).
- PG Connection:
This pin can be left open or be tied to GND when not used, But pull up to VIN can drive it to high, only for test this device is work normally.
- Remote Sense:
Reduce noise, remote route trace too long (from power module to base board).
- Thermal Layout:

Hi Willy,
Thank you for the swift response.
Could you please let me know how did you measure the temperature of the PCB?
Also, please check if the IC is soldered properly onto the PCB. Improper soldering can result in temperature increase.
Best Regards,
Ashika
Hi Willy,
Thank you for your patience
Could you please share the thermal image ?
Also, is it possible for you to share the VIN, VOUT and Switch node oscilloscope images for this device?
Also I see that the values used for the compensation network R_z, C_c1 and C_c2 in the schematic are in accordance to the recommended values in the datasheet.
Could you please increase the output capacitance to slightly more than 203uF as recommended in the datasheet?
or the other option is to lower the R_z in accordance to the output capacitance bank as per schematic
Please let me know as you proceed.
Best Regards,
Ashika