Team, Here are the two questions about the soldering process.
- Regarding the solder paste printing process for TPSM863252RDXR, are there specific process temperature parameters or standards that should be followed to ensure optimal soldering quality?
- Following the completion of the solder paste printing step for TPSM863252RDXR, when performing subsequent reflow or wave soldering on the bottom layer PCB with other components, what are the recommended temperature profiles to prevent damage to the IC and ensure reliable solder joints?
Regards
Brian
