TPS731: Thickness of Gold Layer on NiPdAu Termination

Hi Andrew;

Please clarify exactly the device your asking for the gold layer of the NiPdAu, saw the  GPN on your message TPS3808-EP or TPS731XX-EP but much better to provide the exact device Part number.

BR;

bett

Sure, the exact PN is TPS73118MDBVREP.

Andrew

Thanks, Bett.  Is the upper limit on Au thickness 0.69 uin like I've seen on other TI components?

Hi Andrew;

TI devices meet the following NiPdAu thickness specifications with the min specs NiPdAu = Ni 20uin min / Pd 0.4uin min / Au 0.12uin min

• Minimum: 20 microinch (0.51 micrometer)
• Maximum: Not Specified (NS)

The documentation clearly indicates that no maximum thickness is specified for the Au layer in the NiPdAu plating.

This is directly stated with "Max NS" in the specification.

What TI device have an upper limit on Au thickness 0.69 uin ?

BR;

Bett

The following indicate a Au layer thickness of 0.12 - 0.69 uin on NiPdAu lead finish:

[FAQ] What is the thickness of Gold (Au), Palladium (Pd), or Nickel (Ni) for TI's NiPdAu lead finish? - Logic forum - Logic - TI E2E support forums

A Nickel-Palladium-Gold Integrated-Circuit Lead Finish and Its Potential for So

This was confirmed to be the case on a few other TI PNs I enquired about (SN74LVC8T245-EP, UCC2800, TPS3808-EP), but I'm not sure how universal it is across TI products.