• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 63 subscribers
  • Views 57 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMG3522R050: two-time reflow process

sterie
Intellectual 350 points
Part Number: LMG3522R050


Can the LMG3522R050 component be reflow soldered on the underside of the PCB? In other words, it would undergo the reflow process twice. Can the component withstand this?

Thank you,

  • 0
    TI__Expert 8578 points

    Hi Sterie,

    Thanks for reaching out.

    Page 14 of this application note gives the reflow profile of the our QFN devices.

    https://www.ti.com/lit/an/slua271c/slua271c.pdf

    Please read all of section 5.2 of the document as there are several key points that should be followed. The profiles shown are just examples.

    Note: “TI recommends use of the temperature profile from the solder-paste manufacturer to optimize flux activity within the MSL guidelines for the most thermally sensitive component. See J-STD-033 for more details on MSL classification.”

    Hope this helps.

    Best,

    Pratik A.