Hello E2E Experts,
I am reviewing the land pattern example for this component (TPS22996HQDYCRQ1), which specifies a recommended pad width of 0.22 mm under the body. I would like to confirm whether it is strictly necessary to maintain this exact dimension.
Would increasing the pad width slightly to 0.25 mm cause any issues related to performance, solderability, or component reliability? Please advise if this deviation would have any impact or if it is within acceptable tolerance.