Part Number: BQ25898D
Hi TIer
My customer use BQ25898D in a production project for handheld.
Currently they what to check if BQ25898D need fix to PCB with glue?
This is a question because it is a handheld product that needs to pass a drop test. Simultaneous use of glue can make testing and debugging inconvenient because it is a BGA-packaged die. At the same time, some other issues arise.
So do we have some recommendations or theory to support the customer's judgment whether glue is needed to fix the BQ25898D chip?
