Part Number: BQ25756E
Other Parts Discussed in Thread: BQ25756, TPS26750, TPD4S480, TPS25751, TPD4S201, TPS25751EVM
We are designing a high-performance battery pack. We are using the BQ25756E to implement a 140W Bidirectional USB-PD 3.1 charging interface.
I would appreciate a review of my schematic and design calculator, specifically regarding component selection for 140W operation.
System Specifications:
Application: Portable Power Bank with 6x 21700 Cells.
Battery Config: 6S Li-ion (Standard NMC).
Battery Voltage: 16.0V (Min) – 25.2V (Max).
Input/Output: USB-PD 3.1 EPR (5V, 9V, 15V, 20V, 28V).
Target Power: 140W (28V @ 5A).
Inductor: 3.3microH (Saturation Current > 15A).
Sense Resistors: 2mohm (Input RAC), 5m (Battery RBAT).
Design Methodology & Questions: I have attached my schematic and the design calculator. Please note a specific configuration regarding the Input Voltage settings:
The "Hybrid" Calculator Setting: In the design calculator, I set VAC(min) to 20V (Row 5) but set ACUV to 4.2V (Row 58).
Reasoning: I want to support standard 5V USB charging (at low power), but I only require the full 140W capability when connected to a 20V+ EPR source. Setting VAC(min) to 5V in the tool resulted in unrealistic inductor sizing (~10microH+) for 140W.
Question: Is this "Hybrid" approach safe? Will the BQ25756 stability/compensation loop handle the transition from 5V (low power) to 28V (high power) with the 3.3microH inductor selected for the higher voltage range?
Inductor Selection (3.3microH): The calculator flags 3.3microH as close to the minimum. Given the wide input range (5V–28V) and wide battery range (16V–25.2V), is 3.3microH the optimal trade-off for a 140W target, or should I move to 4.7microH to reduce ripple at the expense of transient response?
Thermistor Placement: I have placed a 10k NTC thermistor physically adjacent to the main switching FETs (Q19-Q22) to throttle current if the power stage overheats. Does the BQ25756 handle thermal throttling autonomously via the TS pin, or does this require MCU intervention?
Finally, overall is my schematic ready to move into the PCB layout phase with component selection, which MOSFETS would you reccomend here?
Schematic and Calculator attached.
BQ25756_DESIGN-CALC-V01X3.xlsx
Thank you for your time and guidance.