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LM317: Double mechanical specification for TO-263 package

Roman Schwarz
Prodigy 10 points

Part Number: LM317

Hi

I want to use the LM317 in the TO-263 case. There are two sets of mechanical specifications for the TO-263 in the datasheet (KTT R-PSFM-G3 and KTT0003B). The dimensions differ significantly between the two specifications. Which is the correct specification?
 
Kind regards,
Roman
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  • 0
    TI__Intellectual 1890 points

    Hey Roman- actually both of them are correct.

    There are two different package drawings because there was a silicon design refresh on existing LM317KTTR as SFAB 150mm process is discontinued. The legacy chip (150mm SFAB) and new chip (200mm FFAB) are built using different leadframe so the package drawings are different.  We haven't started shipping the new chip yet so you should refer to KTT R-PSFM-G3 package drawing for the current material. The new chip will need to be refered to KTT0003B. 

    Let me know if this helps or if you have any further questions.

    Thanks,

    Su