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Assembly related issue of PTH12040W

Manish Sharma
Prodigy 10 points

Hi All,

Due to space problem we have placed the subjected device on bottom of the PCB, while soldering(Re-flow Oven) the device drops and need to hand solder.

Can anyone suggest the solution? We don't want to used through hole device due to complexity of the PCB.

Regards,

  • 0
    TI__Mastermind 38230 points

    .

    Manish:

    There are no power modules which can be reflowed on the mother  bottom side .

    They will either fall off during the reflow process or they will have to be reflowed facing upward , located atop the  host board during the final reflow process.

    Tom