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LMR24210 PGND pin

Other Parts Discussed in Thread: LMR24210

Noticed in the latest LMR24210 datasheet there are references to a PGND pin; however, after inpsecting the diagram of the ball/landing pattern, I do not see a PGND pin on the part.  Is this a typo or am I missing something here? 

I know some switchers have a PGND pad on the bottom of the part.  I do not see on on this package. 


  • Hello Andrew,

    Which diagram of the landing pattern are you referring to? In the datasheet on page 3 you will find the pin description section. Balls A1, B1, C1, and D1 are marked as GND and they are the power ground pins/balls. I hope this helps.


  • Ashkay,

    Andrew is right, if you look at the datasheet in the connection diagram and even in the pin list there are references to "PGND". That can be confusing since it is not obvious, at least at first sight, that GND and PGND are the same.

  • What's interesting is that the figure 8 and 9 symbol shows an AGND, PGND and a GND pin.  Not to mention in the pin description table under AGND, it says "Ground for all i nternal circuitry other than the PGND pin" yeah, it is a little confusing.  TI needs to clarify this in their documentation.

  • Thank you for all of your commends. We will fix the ground naming scheme in the datasheet.

    To clarify, please refer to the connection diagram in page 2 and the pin descriptions in page 3 for your layout. The A1, B1, C1 and D1 bumps are connected to the source of the low side power FET. They are referred as GND and PGND bumps in the datasheet. The input capacitors should be placed as close as possible to these bumps and VIN bumps. Cout caps should also be connected to these bumps.    

    The AGND bumps are the ground reference for the control circuity. Connect the two grounds together on the board.

  • The application schematic and connection diagram are updated in the datasheet. Please check for the latest documents.