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TPS3707-30DGN

gge
Intellectual 275 points
Other Parts Discussed in Thread: TPS3707

Hello

This is a very specific question regarding the DGN package for the 3707.  Does the PowerPad under the part connect to the GND signal of the part or what signal is the PowerPad connected to?

  • 0
    TI__Expert 5640 points

    On the board, the thermal pad can be soldered to a floating plane of copper or to a ground plane.  If you connect the thermal pad to ground, you will still need to connect  the ground pin of the IC to the board ground.  The substrate silicon (ground) of the IC is glued to the thermal pad but this makes a poor electrical connection. 

     

  • 0 in reply to Scot Lester
    Intellectual 275 points

    Scott

    Thank you very much for the quick response.  So the pad than is just needed for thermal reasons.  If I wanna use this to replace a MAX708 part which is laid out on a board without the thermal pad than the reprocussions are decreased thermal efficiency right?  It seems though the part only draws in the uA range for IDD so I don't see how there could be many thermal issues.

    Thanks again,

    Gary

     

  • 0 in reply to gge
    TI__Expert 5640 points

    Yes.  It is not a requirement to connect the thermal pad to anything on the TPS3707.  The device normally dissipates a couple of milliwatts which doesn't amount to much thermally.