This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMR62421 - Layout guidelines for WSON (NGG) package

Other Parts Discussed in Thread: LMR62421, LM2832

Do you have an example of a thermal layout for this device/package ? 

Figure 24 in the datasheet shows a possible technique, but does not elaborate.  It would be nice to know the best locations for additional thermal vias along with proper solder mask definitions.  The EVM is not a good guide.

Please advise.

Thanks

Dave Johnson