LP2950-N Junction-to-Ambient thermal resistance for TO-252

Nathaniel Wilson

Intellectual 1990 points

Other Parts Discussed in Thread: LP2950-N

Hi team,

Is there any information on what the junction-to-ambient thermal resistance is for the TO-252 package for the LP2950-N? Specifically the LP2950CDT-3.3. The datasheet mentions junction-to-ambient thermal resistances for many of the available packages for the LP2950-N but not for the TO-252.

Any help with this would be much appreciated. Thanks!

over 10 years ago

0 Donald Jones over 10 years ago

TI__Mastermind 22610 points

A formal request has been submitted (#5195) for thermal simulation of LP2950CDT-x.x.

The que of requests ahead of this is not too bad, so I expect the results to be available by 22-Nov-13.

0 Donald Jones over 10 years ago

TI__Mastermind 22610 points

LP2950CDT-x.x TO-252 (NDP)

Theta JA-High K = 52.6°C/W

Theta JC, top = 66.0°C/W

Theta JB = 4.6°C/W

Psi JT = 22.9°C/W

Psi JB = 4.5°C/W

Theta JC, bottom = 2.2°C/W

0 Nathaniel Wilson over 10 years ago in reply to Donald Jones

TI__Intellectual 1990 points

Thanks for getting back so soon Donald!

Can you explain the meaning behind the "High K" in the Theta JA measurement?

0 Donald Jones over 10 years ago in reply to Nathaniel Wilson

TI__Mastermind 22610 points

'High-K' is in reference to the JEDEC spec "JESD51-7 : High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages".

If the package has a thermal pad that is soldered to the PCB it also includes the JEDEC spec "JESD51-5 : Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms"

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LP2950-N Junction-to-Ambient thermal resistance for TO-252