LM2574HV SOIC Package Thermal Data Sheet Issue

Richard Elmquist

Other Parts Discussed in Thread: LM2574HV

The data sheet for the LM2574HV seems to specify the θja differently in different locations of the data sheet.

The specifications for the DIP package on page 6 and in figure 17 of the data sheet seem to be the same, but there appears to be a discrepancy between the SOIC numbers.

Is the θja for the SOIC package 102 C/W for 1 sq. in. of copper and 78 C/W for 4 sq. in. as shown in figure 17 or are the specifications shown on page 6 correct?

Thanks for your help with this!

Richard Elmquist

over 9 years ago

0 YangZhang over 9 years ago

TI__Genius 11085 points

Based on the datasheet, I think the number '2' was in the wrong position in the EC table in page 6.

If the number '2' went back to the end of the upper cell, it would be consistant with Figure 17: 102 with 1 square inch of copper and 78 with 4 square inch of copper.

Theta JA with 4 square inch of copper should be lower than that with 1 square inch of copper.

I will confirm my conclusion with our PE and let you know if otherwise.

Regards,

Yang

0 Richard Elmquist over 9 years ago in reply to YangZhang

TI__Mastermind 45250 points

Yang,

Thanks for your response!

Richard Elmquist

0 YangZhang over 9 years ago in reply to Richard Elmquist

TI__Genius 11085 points

Thank you for pointing it out. We will update the datasheet to fix it.

Yang

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LM2574HV SOIC Package Thermal Data Sheet Issue