My customer is military customer asking for details on the process how the following ICs are made. Is there a document to answer these questions.
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What is the pin plating material?
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What is the plating thickness?
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How is the plating deposited (eg. electroplate, immersion, hot dip)?
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Is the plating heat treated (eg. annealing)?
LM117H |
LM117H/NOPB |
LM135H |
LM135H/NOPB |
LM136H-2.5 |
LM136H-2.5/NOPB |
LM2991S |
LM2991T |
LM337IMP |
LM70CIMM-3 |
LM8261M5 |
LM8261M5/NOPB |
Sujeeva Wettasinghe
Avnet FAE