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TPS63036 Footprint

Steve Jarvis
Intellectual 600 points
Other Parts Discussed in Thread: TPS63036

Hi,

where can we find the footprint for the TPS63036? It is a 8-pin WCSP - YFG (R-XBGA-N8) - 1.854 mm x 1.076 mm

Thanks

Rick

  • 0
    TI__Expert 7110 points
    The footprint usually depends on the board manufacturing constraints.
    An example for this device can be 275um for the Pad and 350um for the solder mask expansion.
  • 0 in reply to Florian Feckl
    Intellectual 600 points
    Thanks Florian,

    but all the PCB manufacturers we contacted say they cannot comment on that and they said to follow the recommended footprint.

    Why is the footprint not available for that device?

    Also where on the TI website can we find a collection of all footprints? I assume there is a location where all footprints are collected together but cannot find it...

    Thanks

    Riccardo
  • 0 in reply to Steve Jarvis
    TI__Expert 7110 points
    What we can offer are drawings of the packages. That is what we have in the datasheet.
    There is a common database of the packages on TI.com available.

    As a guidance for the footprint, you can use the EVM as a starting point with the values of 275um for the Pad and 350um for the solder mask opening.

    A general Design Note is
    www.ti.com/.../spraav1b.pdf
    which has a lot of tips and hints how to develop the PCB design for a BGA Package.