In the layout guidelines for TPS562209/TPS563209 (section 11) point 5 states:
5. Do not allow switching current to flow under the device.
What is the reason for this layout restriction? In particular, does it really mean current, or does it mean switching voltages (the SW node)?
Routing to VIN under the device package looks like it works well in a layout we are working on, but this violates recommendation 5.
I find it hard to believe that routing VIN under the device would have much impact on the circuits behavior. Given the size of the package, I even find it hard to believe that routing SW under the package would make much of any difference to the circuit since we are already pushing the pad around and the added trace area under the device is not much more than the pad area.