TPS5430 over heat issue

Jacky Chen29

Other Parts Discussed in Thread: TPS5430

Hola,

We have a serious over heat issue about TPS5430, 50% production error rate by TPS5430 over heat causes MSP430 internal flash data error.

After analysis and we found the power pad(thermal pad) solder paste is not enough and it will causes device over heat and increasing leakage current！

Is thiis thermal pad connected to GND pin？why it causes increasing leakage current by poor solder paste？

over 10 years ago

0 JohnTucker over 10 years ago

TI__Guru**** 191445 points

TPS5430 will certainly over heat if the thermal pad is not properly attached. Also the PCB connection must provide adequate heat sinking ability. Usually it will be connected to an internal GND plane or backside copper fill area. What do you mean by "increased leakage current"? Are you measuring the input current at Vin with no load?

0 Jacky Chen29 over 10 years ago in reply to JohnTucker

Genius 4735 points

Hola John,

Thank you for your reply and sorry my fault it's caused by TPS79801-Q1 not TPS5430！

Yes, I have measured the current at output side from TPS79801-Q1, when device is at normal temperature and the output current is about 20mA,

but when I measured the over heat device and the output current is about 120mA！Is this caused by poor solder from thermal pad？

0 Jacky Chen29 over 10 years ago in reply to Jacky Chen29

Genius 4735 points

Hola John,
Do you have any update？Thank you.

0 JohnTucker over 10 years ago in reply to Jacky Chen29

TI__Guru**** 191445 points

I do not support TPS79801-Q1 and you are unlikely to get a response in this forum. Please repost in the linear regulators forum with a new title.

Power management

Power management forum

TPS5430 over heat issue