Hello! I am a Senior Process Engineer for an Automotive Electronics Manufacturer.
We are having solder shorting issues on the LP3981. Looking at pg 24 of 25 in the lp3981.pdf document, it calls out 1:1 ratio for Solder lands to Device Pads.
Typically you print a "window pane" or other design (We use a custom design to reduce solder voids) having a reduced solder volume - typically about 50%. I have found that our stencil aperture was made smaller (less solder volume) than I typically recommend. I suspect that this is what is causing our solder shorts on the outer pads because we do not see this on similar packages.
Here is my question: I do not see a recommended stencil aperture layout or recommended solder volume or stencil thickness in this documentation. Rather than I try to optimize the stencil, please advise what is the stencil thickness & aperture recommendation for this package type (solder Volume). Please advise.
Your Time is apprecuiated!
Darrell McCullough
Senior Manufacturing/Process Engineer
Phone: (248) 476-5571 x9849
E-mail: darrellm@danlawinc.com
Web: www.danlawinc.com
