bq40z50 3d model

Hi Tom,

We do not have STEP files available, but you can take a look at the TI Design (TIDA-00883) for the bq40z50 to see the design files that we do offer.

Best,

Justin

Hi Justin,

I'm looking for the 3d model of the case for the bq40z50. The only 3d model on the TIDA-00883 page is for the BQ2961.

Is there a bxl file for the bq40z50 package (32VQFN)? I remember reading that if a 3d model wasn't available, TI would produce one in about a week if requested.

Regards,

tom

Tom

The bq40z50 database was released before we added 3D attributes to our symbols. I will send you a another database that has a 3D component for the same package.

Tom

Thanks, Tom. We can handle just about any 3d format.

Tom

Tom,

Found it, sorta...

I did another search on TI's website and found that one version of the CC2640 uses the same RSM package name, and has both bxl and step files! The dimensions check out between data sheets, EXCEPT the Exposed Thermal Pad for the CC2640 is 2.8 x 2.8 mm and for the bq40z50 is 1.40 x 1.40 mm!?!

Is this a common TI occurrence? 2 different parts have the exact same package name (RSM [S-PVQFN-N32]), but the packages are NOT exactly the same?

tom

p.s. I noticed that the data sheet for the bq40z50-R1 is missing the 2nd and 3rd pages that show the rest of the RSM package and the footprint drawings. The original version had them.

Tom
The pad size is not part of the package spec, so it is common to see more than one pad area for a given designator. The pad size is adjusted based on the size of the die, but there are usually just 2 or 3 size variations available.

Tom