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CSD17308Q3 Failure & Recovery problem

Other Parts Discussed in Thread: CSD17308Q3

My customer product is OCXO. It use TI CSD17308Q3;  This OCXO need temperature on 110 degrees; product use Ampfier to driver MOS and MOS heat crystal through  thermal conductive adhesive ;  The early stage of the product aging test is ok, but some Mosfet do not work  after about 7 days;

A strange appearance is that these problem MOSFET can work again after heat gun heat it. So anybody can give some comments?

Does Mosfet not work because it has heat effect ?

  • Frank,

    It is extremely unlikely that the MOSFET itself has failed, it is most likely that there is some sort of thermo mechanical issue occurring on your pcb that supplies power to the FET.

    Heating a MOSFET up should not make a FET work again, it would change temperature dependent characteristics such as threshold or resistance but not have it work again. The only way this intermittent fault could occur is if the internal wire bonds of the device were disconnected somehow and the heating action forced the connection back together. As I said before, this is extremely unlikely.

    As you are using a heat gun on your whole PCB to heat the MOSFET up, it may well be that there is a dry joint elsewhere on the board causing the FET gate signal or voltage to the drain to go away.

    If you are sure this is not the case then maybe you could send the FET in through your normal sales channels to our failure analysis team to make sure the “problem” FET is still within datasheet specifications and determine if the FET is the source of your issue or not.