1) What is the maximum power dissipation value for the various packages?
2) What pin, if any, is the exposed thermal pad connected to on the DRV package?
3) The thermal resistance to the board seems to be lowest on the DBV package and the thermal resistance of the extra thermal pad on the DRV package is much higher in spite of the extra contact area. Which pin(s) of the DRV package are the most effective heat sinks?
Can anyone help me?
Thanks, Gareth