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REG71050: Information not obvious on the data sheet

Part Number: REG71050

1) What is the maximum power dissipation value for the various packages?

2) What pin, if any, is the exposed thermal pad connected to on the DRV package?

3) The thermal resistance to the board seems to be lowest on the DBV package and the thermal resistance of the extra thermal pad on the DRV package is much higher in spite of the extra contact area. Which pin(s) of the DRV package are the most effective heat sinks?

Can anyone help me?

Thanks, Gareth

  • hi Gareth,

    1) normally Pmax is specified vs package for FETs... in your case you have table 7.4: knowing Tjmax = 150degC you can calculate the Pdiss max from the max Tamb (for example) using the Rja... refer to spra953 for details...

    2) the details are at page 29 / 30 / 31

    3) the DRV package has better thermal peformance than the DBV one, for the simple reason the DRV has a thermal pad (the DBV not). For the same reason, the th. resistance to the board is higher, because the heat goes down thanks to the thermal pad (while for the others can't)

    hope this helped a bit

    KR
    Vincenzo