Hi,
I'am designing a board using LM5110-1 to drive an half-bridge between Ground and a negative voltage.
So, VEE is connected to the negative voltage and IN_REF is connected to Ground (IN_A and IN_B drived with positive logic level signals).
I want to use the 4x4mm WSON-10 package which has a thermal pad. This thermal pad has to be soldered to the printed circuit board, but the datasheet don't indicate to which electrical potential it has to be tied to.
Please, could someone tell me if this thermal pad has to be connected to the same potential as VEE or IN_REF ?
Thanks in advance
Best regards
David