Other Parts Discussed in Thread: PMP11311, TIDA-00668
I'm working on a design based on BQ51003 with a low Icc due to usage of a small battery (60mAh) : high constraint about PCB size : very small.
I'll use a 4 layers PCB, but after reading documentation and have a look on reference design, I've few questions :
- PCB thickness : 0.8mm possible? or not recommanded? with the small Icc not necessary to use 1.55mm?
- layer thickness equal 0.036 mm (Tpo, Mid1, Mid2, Bot)
- about via in Pad for BGA footprint :
hole size 0.152mm, diameter =0.254mm ?
via tenting on the bottom mandatory
is it necessary to fill via?
I can't find these informations in reference design, thanks for your help, recommandations and feedback