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TPS62231-Q1: The PCB attachment of TPS62231-Q1, TPS62290-Q1 and TPS62260-Q1

takahiko yokota
Mastermind 7135 points
Part Number: TPS62231-Q1
Other Parts Discussed in Thread: TPS62290-Q1, , TPS62260-Q1, TPS62230, TPS62260

Hi

I got a question about the fillet from my customer.
There are written the following text attached link.
As long as I read them, I think TPS62231-Q1 is not formed the fillet, TPS62290-Q1 and TPS62260-Q1 are formed the fillet.
Are these understanding correct?
"The exterior fillet formation may vary based on manufacturing factors, such as flux activity, solder
volumes, and overall standoff height. Due to factors outside of TI’s control, no assurance for consistent
solder fillet heights on the package sides during assembly can be made. IPC-A610D does not require a
side fillet, since the side terminations are not plated. While it may appear the wetting is reduced on the
side of the component, the solder joint underneath is not affected (see Figure 14)."
Best regards,
Yokota
  • 0
    TI__Guru*** 142750 points
    Correct, the TPS62230 family has a different leadframe than the TPS62260 family. Its leads do not extend to the each of the package, as shown in the package drawing, and would then not create the same type of solder fillet for inspection purposes.

    What does your customer need in the package, Vin, Vout, and Iout?