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TLV62085: Solder mask application

Andreas Pfaeffli
Prodigy 10 points
Part Number: TLV62085

What is the reason for such a special land pattern and solder mask proposal for TLV62085 device. 4 out of 7 pads do not get covered with solder mask, 3 out of 7 get covered partially. This is leading to a uneven PCB surface in PCB manufacturing. Is there a good reason to do as recomended by your datasheet?

  • 0
    TI__Guru*** 145360 points
    The second page of the packaging information shows that this land pattern uses both SMD and NSMD pads. The SMD pads are used for the 3 power pins (VIN, SW, and GND). These pins typically have large copper pours connected to them on the PCB to carry the current and heat. If NSMD pads were used here, the copper pad size would be effectively bigger (because the soldermask opening is larger than the copper 'pad'). Due to the increase in exposed copper, this can lead to insufficient solder on the pad since it may be spread too thin.

    The drawing is just a recommendation. It is always best to work with your PCB manufacturer and assembly house to work within their capabilities and expertise.