Hi,
I want to use a CSD23280F3 in our new product but in my opinion something is weird about the reommended footprint in the datasheet (page 9) :
As we can see on the second figure the stencil is open over a surface where part of it is covered by the solder mask, so according to this figure there will be solder paste on the solder mask during the production, and I don't understand what is the purpose of this.
Could you please explain to me why this is done this way, or tell me if I didn't understand these figures ?
Best regards,
Guillaume
