CSD17484F4: Assembly recommendations

Pongo

Part Number: CSD17484F4

Hello,

Having some behavioral issues with boards we just got back containing femtofets, specifically CSD17484F4T, and am wondering whether you can offer any recommendations for placement?

1.) Am I correct that these parts are ROHS compliant, and that the outermost stackup layer is Au? In the "Packaging Information" portion of the datasheet there is a footnote (6) which says to call regarding the lead/Ball finish. Is it safe to assume that if we ordered CSD17484F4T, that we are working with the Au finish, and not the lead finish?

2.) Is there a recommended solder/flux?

3.) What are the reflow/assembly temperatures for this part during assembly?

4.) What is the recommended cleaning procedure for this part if there is one?

5.) Do your answers apply to the rest of the femtofet family?

Best Regards,

Mark

over 6 years ago

0 Brett Barr1 over 6 years ago

TI__Mastermind 18200 points

Mark,
I reached out to our packaging team, we should have an answer for you shortly.

0 Pongo over 6 years ago in reply to Brett Barr1

Intellectual 270 points

Brett,

Any feedback from your packaging team yet? Also, I left out that we are placing these parts on 2 oz copper, which is a bit unusual, and might be relevant to their response.

Mark

0 Brett Barr1 over 6 years ago in reply to Pongo

TI__Mastermind 18200 points

Pongo,
No I am still waiting for a response from our packaging team:

This won't answer all your questions but have you seen the app note regarding mounting FemtoFET?

www.ti.com/.../getliterature.tsp

0 Pongo over 6 years ago in reply to Pongo

Intellectual 270 points

Thanks Brett,

I'll be sure to pass this along.

Mark

0 Brett Barr1 over 6 years ago in reply to Pongo

TI__Mastermind 18200 points

Mark,
This is the response from our packaging team:

1.) Am I correct that these parts are ROHS compliant, and that the outermost stackup layer is Au? In the "Packaging Information" portion of the datasheet there is a footnote (6) which says to call regarding the lead/Ball finish. Is it safe to assume that if we ordered CSD17484F4T, that we are working with the Au finish, and not the lead finish?

Yes, gold finish.

2.) Is there a recommended solder/flux?

This should be in the application note I sent you.

3.) What are the reflow/assembly temperatures for this part during assembly?

Same as above.

4.) What is the recommended cleaning procedure for this part if there is one?

Application note says to use "no clean" flux

5.) Do your answers apply to the rest of the femtofet family?

Yes

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CSD17484F4: Assembly recommendations