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UCC28950: How is the thermal dissipation made?

Part Number: UCC28950
Other Parts Discussed in Thread: PMP7246

Hi,

I see in the PMP7246 ref. design that they are using "BSC057N08NS3" MOSFETs. Those are in a SuperSO8 package.

This is my first time using that type of package in power applications.

Can anyone describe how is the heat-sinking done/calculated ?

Thank you !

  • Hello Catalin

    You will have to estimate the device power dissipation and then you can use the Thermal Characteristics information on the device datasheet (Page 2) to estimate the device junction temperature for a given dissipation. Since this is not a TI device I'm afraid I can't really help much more than that so you should contact Infineon for further application details.

    Regards
    Colin