We have the application with limited space on RF/Microwave hybrid frequency upconverter (hybrid means chip/die connecting by gold bond wire)
The maximum space allowed is 0.2 inch square while this QPN package dimension is 0.197" x 0.197". That is the reason we have to use die form to attach to our carrier.
We are also struggling in term of RF Extraneous PM Modulation (Phase noise) specification -154dBc/Hz Single Side Band
1. Does TI offer TPS7A47-Q1 in die form ? and if the answer is yes, who we need to contact ?
2. Is LDO regulator the most phase noise contributor for the entire upconverters including RF amps, switches, filters, etc...?
Alex Martinez (RF engineer) at Teledyne Microwave Solutions