This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS51916: Clarification on EPAD recommendation

Part Number: TPS51916
Other Parts Discussed in Thread: TPS3808

Hi ,

We are facing an issue with the components having Thermal PADs. The issue is that the excess solder paste on the thermal PADs causing malfunction to the part which eventually resulting in board failure.

We have #TPS3808G33DRVT and #TPS51916RUKT in our board suspecting the above mentioned scenario.

Eventhough the datasheet says to use separate smaller solder PADs, we have implemented as a single PAD only. Refer below image for TPS51916 solder pad details implemented in our design.

Similar is done for TPS3808 also.


Do you think this approach will cause any impact which can leads to the above failure?


Awaiting your quick reply.

  • Hello,

    Using separate small pad is a recommendation.
    I think it is fine to use single pad as long as the solder paste is applied correctly.

    Howevery, this is more related to soldering technique. You'd better to check with assembling engineer if they have concern.