Other Parts Discussed in Thread: TPS3808
We are facing an issue with the components having Thermal PADs. The issue is that the excess solder paste on the thermal PADs causing malfunction to the part which eventually resulting in board failure.
We have #TPS3808G33DRVT and #TPS51916RUKT in our board suspecting the above mentioned scenario.
Eventhough the datasheet says to use separate smaller solder PADs, we have implemented as a single PAD only. Refer below image for TPS51916 solder pad details implemented in our design.
Do you think this approach will cause any impact which can leads to the above failure?
Awaiting your quick reply.