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CSD87384M: MPN#CSD87384M

Part Number: CSD87384M

We need your assistance to understand more detail about this comp pre-solder spec measurement. Is there any pre-solder spec that your manufacturer produce this comp?Recently we have detected high fallout on solder bridging issue on this particular comp and we have study our internal process and didn’t found any anomalies.


  • Akmal,
    Thanks for posting and I am sorry to hear you are having issues.
    I am not entirely sure what you mean by pre-solder spec, I think it may be one of two things:
    1. What are the size specification of the solderable metal on the actual device? These are given in the CSD87384M package drawing on page 15 of the datasheet.
    2. What is our recommendation for solder stencil on the PCB? The recommended solder stencil is also in the CSD87384M datasheet on page 16, in addition to what is in the datasheet we also have an application note that goes into more details on assembly with this device, it is titled SLMA007-Design Summary PowerBlockII and can be found as well as link below on the summary TI web page for the CSD87384M under technical documents here:

    Direct link for application note is here:

    If you have already done all of our recommendations in the information above then I would suggest you contact your local TI representative and we can arrange for one of our SMT experts to give you some advice.