Hello TI, about your CSD23280F3 datasheet ("SLPS601A, 2016 Revised August 2017") possibility of a datasheet typo?
On page 1, Absolute Maximum Power Dissipation is 500mW. Note 1 (page 1) also says 1-in-sq of copper is required.
If thermal resistance is 255C/W, Pd = 1/2W and Tamb=25C, all that equals 150C max junction temp, OK.
However on page 3 is "Thermal Information" and it shows that 255C/W is for "minimum Cu mounting area".
Appears that "minimum Cu mounting area" gives 255C/W. As such, page 1 has the typo? Since Abs-Max-Rating=500mW doesn't require 1 in-sq copper?
Also is this a long-term popular part, that is staying on the TI roadmap, or should we consider anything more popular?
Compliments, TI has cutting-edge & remarkable small parts.
