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CSD18504Q5A: Pad on Via for drain terminal

Oba
Genius 15750 points
Part Number: CSD18504Q5A
Other Parts Discussed in Thread: CSD18511Q5A

Hello,

 

I have a question for the bellow devices.

・CSD18504Q5A

・CSD18511Q5A

 

Does TI recommend to use Pad-on-Via for Drain terminal of these devices?

Do you have any recommended design data for pad, mask and via?

Regards,

Oba

  • 0
    TI__Mastermind 29525 points

    Hello Oba San,

    Nice to hear from you again. We have consulted with our packaging team. Vias are quite important for enhanced thermal performance. You can put the vias outside the pads (near the pins) as shown in the attached picture. You can also put vias in between the opening of the solder stencil (4 larger rectangular shapes) but not directly printing solder paste on top of the vias. Please let me know if you have any additional questions.

  • 0 in reply to John Wallace1
    TI__Genius 15750 points
    Hello,

    Thanks for your reply.
    You mean TI doesn't recommend Pad-on-Via for drain terminal?

    Regards,
    Oba
  • 0 in reply to Oba
    TI__Mastermind 29525 points

    Via_placement.pdfHi Oba,

    It is OK to use Pad-on-Via for the drain terminal. The recommendation is to place the vias in the channels between the openings in the solder stencil to prevent printing solder paste directly onto the vias. The pad, mask and via design will depend on the customer's DFM rules. Please see attached. This is for illustration purposes only and the customer should decide on the via placement and size depending on their DFM rules.