• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 62 subscribers
  • Views 217 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TLV743P: Thermal resistance

Shinya Sawamoto
Expert 5260 points
Part Number: TLV743P
Other Parts Discussed in Thread: LP5907

Hello team,

I have a couple of questions related the defined value of TLV743 thermal resistance.

(1) We can get 228.4C/W(for SOT-23) of Rja from the datasheet. Could you provide information of the test board condition? (PCB size, # of layer, % of cupper coverage, cupper thickness and so on) I'd like to know it to compare thermal performance with other benders' LDO in the same package as fair as possible.

(2) I found LP5907 in the same SOT-23 package has 193.4C/W, better thermal performance. How come the difference between LP5907 and TLV743?
If the difference comes from device itself, I may change the device to LP5907.

Thanks in advance.
Shinya Sawamoto

  • 0
    TI__Genius 10200 points

    Hi Shinya,

    1. The test board is the industry standard JEDEC High-K Thermal Test Board. The parameters for this board are described in JESD51-7 which you can freely access after registering an account here:

    https://www.jedec.org/user/register

    https://www.jedec.org/system/files/docs/jesd51-7.PDF

    2. The LP5907 has a different Rja compared to the TLV743 because it has a different design and layout. Keep in mind that the final Rja of the device will depend on the PCB layout, and it is possible to reduce Rja by 30% to 40% with a thermally optimized layout that includes copper pours on outer and internal layers with thermal vias around the device to connect these pours. 

    Thanks,

    Gerard