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TPS8268090: TPS8268090 Inductor Body and Substrate clearance

Part Number: TPS8268090
Other Parts Discussed in Thread: TPS62800

Hi TI Experts,

We need to know what is the gap ( minimum height ) under the inductor component between inductor body and substrate, please refer picture below :

The concern is we need to use mold compound with correct filler size to prevent any unfilled/void.

Please advice,


Teach Me

  • Hi Teach,

    Maybe you can send me the details of your application via private message so that we can discuss your specific case.

    We do not specify anything around these dimension details. As well, we do not require or recommend that customers overmold or underfill these MicroSiP devices.

    Finally, the new TPS62800 family offers a lower height and smaller size, making it very suitable for portable applications.