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DCR022405: soldering bottom layer

Toshihiro Watanabe
Genius 10235 points
Part Number: DCR022405

Hello,

We are thinking to soldering DCR022405P-U and DCP022415DU SOP package to both top and bottom layer of PCB.

Is there any concern or issue to soldering them on top and bottom layer of PCB?

Please let us know if any issue is existing.

Best regards,

Toshihiro Watanabe

  • 0
    TI__Guru 50120 points

    Hi Watanabe-san,

    From the looks of the SOP package I don't think there would be an issue with solder on top layer of PCB. I am not aware of any issues with the package, however I'd imagine the challenge for this package is when you solder it on the bottom layer of the PCB you might encounter issues with the device during reflow/rework. Unlike the current packages, this package does not have a large EPAD that provides both thermal relief an "anchor" point for the device to sit on. If the device is heavier than the solder tension on the pins then it may fall off during reflow. 

    Regards,
    Jimmy

  • 0 in reply to Jimmy Hua
    TI__Genius 10235 points

    Hello Jimmy-san,

    Thank you for your answer. I think this depends on manufacture company handle or not.

    Is there any other concern you have like performance degradation or shorten life time?

    Best regards,

    Toshihiro Watanabe

  • 0 in reply to Toshihiro Watanabe
    TI__Guru 50120 points
    Hi Watanabe-san,

    Not to my knowledge. I don't think there are any concerns regarding performance degradation of the device if it is used in accordance to the datasheet specifications.

    Regards,
    Jimmy