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TPS22912C: About the BGA package

John Cheng17
Prodigy 100 points
Part Number: TPS22912C

Dear Ti experts,

I have some question about TPS22912C BGA package information, please help.

  1. Chip pad size (Note: the pad on chip side, not PCB layout pattern. Please refer to the second picture below)
  2. Materials of chip pad and thickness of each metal layer.

Thanks~

  • 0
    TI__Genius 10855 points

    Hi John, 

    Thanks for reaching out on E2E!

    Unfortunately, we don't disclose this information due to proprietary reasons. In general, the chip pad size / metal thickness doesn't have any influence on layout or the placement of the device for the application. 

    Could you help me understand why this information is necessary? Maybe we can provide some other information regarding the application.

    Thanks,

    Arthur Huang

    To find the latest information on Power Switches, visit www.ti.com/powerswitch