Hi,
I'm using on a space application LM117HVGW-QML chips.
I need some information about internal thermal protection circuitry that is evoked in datasheet (SNVS357D– MARCH2006– REVISED APRIL2013).
* Which type of temperature limit is implemented (junction temp limit) ?
* Can we consider this protection will protect the chip from all defects (translated into thermal overheat): permanent or transient current overload will be fully covered by this protection and will avoid destruction or damage to the chip?
* What is the temperature trigger limit for the protection ?
* Is there an hysteresis system on the protection for desactivation?
* In the Note 2, below "Absolute Maximum ratings" table of the datasheet, "PFM" package is evoked. Is it equivalent to CFP GW package ?
* In Figure 5 of the datasheet, wich curve do I have to consider for the "CFP GW" package (there are only "T", "K" and "H" package codes on the Figure 5 curves) ?
Thanks for your help
Philippe