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LMZ10505EXT: Thermal impact of via fill

Robert Lane1
Prodigy 10 points
Part Number: LMZ10505EXT


The datasheet for the LMZ10505EXT recommends the use of a 6x6 array of 8mil (minimum) vias under the device for thermal dissipation. Is the use of a non-conductive epoxy fill in the vias recommended or would that significantly negatively impact thermal performance? Current PCB design uses a 6x5 array of 12mil vias. 

  • 0
    TI__Guru 50120 points

    Hi Robert,

    As you would expect, a conductive filled via is generally used when there is a need to carry heat/current from one side of the board to another. The conductivity of this fill helps wick heat away from the chip which aids in thermal performance. I'd imagine non-conductive filled vias will not provide as good of a thermal performance. I'd recommend sticking with the conductive filled vias for thermal design purposes.

    Regards,

    Jimmy