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TPS55010: Production Soldering Issue

Part Number: TPS55010

We have followed your layout guidelines, and electrically the part works well (see attached, U31).  However, in production the part is not soldering well.  The part is moving during the soldering process to the extent that it often needs to be manually resoldered.  Do you have any suggestions to improve production solderability?

  • Dave,

    TPS55010 is a 16 pin QFN package.  That package is common to quite a few devices.  I have not heard of any particular soldering issues.  Did you follow the stencil example as well?  Typically when there are soldering issues, they involve the exposed pad and included thermal vias.  The recommended via hole size is 0.3 mm or 11 mil.  That should be sufficiently small to prevent excess solder wicking.  Can you share your pad placement and solder stencil details?

  • John,


    We understand QFN soldering. The problem is the thermal flow from all the planes attached to the pads. I tried to attach the picture below of our PCB with TPS55010RTER (U31) desoldered.  Is it being removed before you can see it?  I believe it shows the pads and where the solder is going reasonably clearly.  If this is not good enough, I believe I can get pictures directly from our Mentor layout.

    What stencil example?  There is no stencil example that I can see in the TPS51010 data sheet.

    Dave VandeWaa

  • Dave,

    Your attachment did not upload.  You can send it to me directly at j(dash)tucker(at)ti(dot)com.  The fottprint and stencil examples are on page 45 of the datasheet.

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